The divertor is the device that continuously receives the extremely high heat and particle loads from the nuclear fusion plasma. Research and development on the divertor, which is highly reliable for ...

With Moore's Law losing momentum, advanced packaging has become the industry's next significant lever to drive performance gains. At the center of this race is hybrid bonding, widely seen as the ...

Hybrid bonding is gaining traction in advanced packaging because it offers the shortest vertical connection between dies of similar or different functionalities, as well as better thermal, electrical ...

SAN JOSE, Calif.--(BUSINESS WIRE)--Tessera Technologies, Inc. (Nasdaq: TSRA), announced today that its wholly owned subsidiary Invensas Corporation will exhibit advanced bonding and 3D interconnect ...

SINGAPORE, May 1, 2024 /PRNewswire/ -- Kulicke and Soffa Industries, Inc. (NASDAQ: KLIC) ("Kulicke & Soffa", "K&S", "we" or the "Company") announced today that the Company received a sizable order ...

Advanced Micro Devices was hit with a patent infringement lawsuit on Nov. 3 in Texas Western District Court over alleged unauthorized use of semiconductor technologies. The action, brought by Alston & ...

At the National Institute for Fusion Science researchers have introduced a new metallurgical method (brazing technique) for bonding tungsten and copper alloys. They achieved a superior bonding layer ...