SMD components may be a little challenging for the home builder – even though the’re inordinately practical for homebrew PCBs – but if you play around with electronics and solder long enough, you’re ...

BGA soldering is very reliable if done using the correct procedure, so we introduce GA Soldering on PCB board, BGA Inspection and BGA Rework. According to different packaging materials, BGA components ...

The ball grid array (BGA) is a surface-mount chip package that is used to mount embedded devices (e.g. microprocessors) by melting balls of solder between the face of the device and the circuit board.

Electronic devices continue to shrink in size with advancement in chip fabrication technology. Packaging technology has responded with improved formats to present these chips for assembly to PCBs.

[Jack Gassett] is developing a new breakout board for an FPGA. The chip comes in a ball grid array (BGA) package which is notoriously difficult to solder reliably. Since he’s still in development, the ...

There has been much speculation in the industry about whether Intel will stop making LGA package processors in favour of BGA package processors. Well, this speculation may have some traction in the ...