Advanced packaging options continue to stack up in the pursuit of “More than Moore” and higher levels of integration. It has become a place where many high-density interconnects converge, and where ...

Review these critical steps for choosing microelectronics and learn how a manufacturer can help integrate them into your next ...

Interposers and substrates are undergoing a profound transformation from intermediaries to engineered platforms responsible for power distribution, thermal management, high-density interconnects, and ...

Defying conventional wisdom, researchers have uncovered a novel coupling mechanism involving leaky mode, previously has been considered unsuitable for high-density integration in photonic circuits.

Technologists from IMEC and its associated laboratory at Ghent University unveil a unique 3D integration process enabling flexible electronic systems with a thickness of less than 60 micrometers.

A breakthrough in ultra-high density heterogeneous integration has been achieved through an academic collaboration between Taiwan and the US as part of a research project under the "Angstrom ...

CHANDLER, Ariz., Sept. 16, 2025 (GLOBE NEWSWIRE) -- The growing need for compact, efficient and reliable power solutions is driving demand for power management devices that provide higher power ...

BENGALURU, India, Aug. 21, 2025 /PRNewswire/ -- izmomicro, a specialized division of izmo Ltd., today announced a major milestone in silicon photonics packaging, underscoring its role as a pioneer in ...