Having finished the Tools of the Trade series on circuit board assembly, let’s look at some of the common methods for doing enclosures. First, and possibly the most common, is injection molding. This ...

Plastic injection defects can lead to large scrap events and lost profits, and splay is one of the more frequent defects a processor must correct. The three main causes of splay are heat, moisture, ...

During the injection molding process, harsh conditions (high temperature, high speed) and deterioration of plastic additives can release high volumes of decomposition gases. Mold deposits, gas burns, ...