Leading-edge applications such as artificial intelligence, machine learning, automotive, and 5G, all require high bandwidth, higher performance, lower power and lower latency. They also need to do ...

Please provide your email address to receive an email when new articles are posted on . The FDA will reevaluate the safety of bisphenol A in food packaging, according to a press release from the ...

Austin, Texas — LSI Logic Corp. has added a measure of packaging flexibility to its ASIC design flow, allowing customers to design a single die that can quickly move from a wirebond to a ...

LONDON--(BUSINESS WIRE)--The global fan-out wafer level packaging (FOWLP) market is expected to post a CAGR of almost 16% during the period 2019-2023, according to the latest market research report by ...

Growing momentum for advanced packaging is shifting design from a die-centric focus toward integrated systems with multiple die, but it’s also straining some EDA tools and methodologies and creating ...

Samsung Electronics has stepped up its deployment in the fan-out (FO) wafer-level packaging segment with plans to set up related production lines in Japan, according to industry sources. Samsung has ...