A new technical paper titled “Glacierware: Hotspot-aware Microfluidic Cooling for High TDP Chips using Topology Optimization” was published by researchers at Corintis. “The continuous increase in ...
The chips that datacenters use to run the latest AI breakthroughs generate much more heat than previous generations of silicon. Anybody whose phone or laptop has overheated knows that electronics ...
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Microsoft unveils new liquid-cooled computer chips — they could prevent AI data centers from massively overheating
Microsoft engineers have devised a new way to keep data centers cool — and it might help prevent the next generation of artificial intelligence (AI) hardware from cooking itself to death. The ...
Forward-looking: Microsoft has taken a significant step toward addressing the thermal challenges of next-generation data processing hardware. The company has developed an in-chip microfluidic cooling ...
It's general knowledge that heat is a significant problem with modern microprocessors. Intel and AMD have collectively held the line at 140W maximum TDP (thermal design power) for the past decade, ...
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