TMCnet

SEMIFIVE and SAPIEN Semiconductors Sign MOU to Develop Next-Generation Micro-display 'CMOS Backplane' Technology

SEOUL, South Korea, Jan. 26, 2026 /PRNewswire/ -- SEMIFIVE, a leading global provider of custom AI semiconductor (ASIC) ...
Digi Times

India-based IC design startup signs MoU with C-DAC for chip development

L&T Semiconductor Technologies, an Indian IC design startup backed by the L&T Group, has entered into a memorandum of understanding (MoU) with the Centre for ...
Nasdaq

SEMIFIVE Signs MOU with Atron Technologies to Collaborate on Semiconductor Design

SEOUL, South Korea, May 23, 2024 /PRNewswire/ -- SEMIFIVE, a leading design solution provider and pioneer of platform-based custom silicon solutions, has announced its agreement of MOU with ...
Yahoo Finance

Delta Electronics (Singapore) Sign MOU with the College of Design and Engineering at NUS to Advance Sustainable Data Center Innovation

SINGAPORE, Dec. 19, 2025 /PRNewswire/ -- Delta Electronics (Singapore) today announced the signing of a Memorandum of Understanding (MOU) with the College of Design and Engineering (CDE) at the ...
Digi Times

South Korea signs MoU with Arm Holdings to establish 'Arm School' for IC design education

The South Korean government has signed a memorandum of understanding (MoU) with Arm Holdings, the UK-based silicon IP provider, to establish an educational institution tentatively named "Arm School." ...
Marine Link

LR and Samsung Heavy Industries Pen MOU for Autonomous Ship Design

LR and Samsung Heavy Industries (SHI) have signed a Memorandum of Understanding (MOU) to develop an autonomous ready ship design to support maritime digitalization and the growing demand for ...