New silicon photonics and next-gen BiCMOS proprietary technologies bring better performance to address the coming 800Gb/s and 1.6Tb/s optical interconnects. Developing a roadmap with partners across ...
In data centers today, there is a constant need for speed. And it's not only inside computer data servers, where one might think it would be. Computing power, capacity, and speed has been increasing ...
Lightmatter, the leader in photonic (super)computing, today announced a technical collaboration with Cadence to develop co-packaged optics (CPO) solutions that integrate Cadence's silicon-proven, high ...
Ayar Labs has announced the launch of the first Universal Chiplet Interconnect Express (UCIe) optical interconnect chiplet, capable of delivering 8 Tbps bandwidth. This development aims to enhance the ...
Current optical module electrical connector technology faces limitations in signal integrity, bandwidth density, power distribution and control connections. Meanwhile, high-density, high-pin count ...
Licensing agreement combines advanced optical innovations from 3M with US Conec's expertise in high-density connectivity solutions for next-generation networks 3M Expanded Beam Optical Interconnect is ...
PALO ALTO, Calif., March 31, 2025 (GLOBE NEWSWIRE) -- Broadcom Inc. (NASDAQ: AVGO) today announced the expansion of its portfolio of optical interconnect solutions to enable AI infrastructure. These ...
Ottawa-based deep-tech startup Hyperlume is poised to disrupt the landscape of AI and high-performance computing with its innovative optical interconnect solutions. The company is tackling the growing ...
Ayar Labs has unveiled the world’s first UCIe (Universal Chiplet Interconnect Express) optical interconnect chiplet. Designed to support AI workloads, Ayar Labs said the offering will eliminate ...
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