The previous articles in this series showed how the successful integration of IP—especially analog/RF, but digital as well—is essentially pre-determined by the practices of the chip development team ...
The first article in this series titled “The common silicon issues in analog IP integration” focused on system-on-chip (SoC) design issues related to incorporating analog IP. Here we begin expanding ...
Today’s electronic devices market demands miniaturized printed circuit boards (PCBs) with a multitude of high-speed functions integrated on a single board. This causes the designers to have traces ...
This file type includes high resolution graphics and schematics when applicable. In the development of SoC-based (system-on-chip) circuit boards, the SoC’s additional capabilities will provide ...
SAN JOSE, Calif., 02 Jul 2012-- Cadence Design Systems, Inc. (NASDAQ: CDNS), a leader in global electronic design innovation, today announced it has acquired Sigrity, Inc., a leading signal and power ...
Fig 1. The die pad in Texas Instruments’ PowerPAD supports the die during fabrication, thus serving as a good thermal heat path to remove the heat away from the chip. Fig 2. TI’s PowerStack 3D ...
I was looking over the week’s posts on Hackaday – it’s part of my job after all – and this gem caught my eye: a post about how to make your own RP2040 development board from scratch. And I’ll admit ...
As the world is becoming increasingly virtual and software is replacing hardware, electrical and electronics engineers are trying to ride the same bandwagon with their tool of choice, PCB (Printed ...
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