IPI distributed an online questionnaire in November 2020 to inform a current inventory of commonly used materials and designs for sealed frame packages. We are grateful to the more than 100 colleagues ...

Advanced Interconnect Technologies Inc. (AIT) has announced two new versions of its lead-frame package family that the company claims combine the best attributes not only of lead-frame but of array ...

For high performance applications, demand for highly integrated packages has increased. This is due to the highly integrated package’s electrical performance advantages of reduction of interchip ...

Peterbilt says its new medium-duty Model 220 can now be spec’d with a clear frame rail package that provides up to 10 inches of additional frame rail space over the previous clear frame rail package.

Dai Nippon Printing Co (DNP) has developed a new lead frame in response to efforts to slim down the semiconductor package mounted on electronic devices, including mobile terminals and PCs. Using this ...

Peterbilt’s new medium-duty Model 220 can now be spec’d with a clear frame rail package that provides up to 10 inches of additional frame rail space (versus the previous clear frame rail package), ...

Peterbilt rolled out a front frame mounting package for the 567’s set-forward axle, targeting faster upfits on new orders. The company announced the option Aug. 14. The provisions add front frame ...