MILPITAS, Calif., Oct. 24, 2012 /PRNewswire/ -- Mobiveil, Inc., a leading Silicon Intellectual Properties provider, today unveiled its plans to add support for the third-generation RapidIO 10xN ...

For the past year, there has been an expressed interest in the communication design community to redefine the interconnect architectures used in today's networking and telecom equipment, sparking ...

The RapidIO interconnect offers many advantages for embedded systems. It combines high bandwidth with low cost and low power, and it is suitable for both control plane and data plane applications.

Communications fabrics are perhaps the last major segment where the light of open standards has yet to shine-84 percent of the fabric silicon that shipped in fiscal 2003 was based on proprietary ...

MILPITAS, CALIF. –– August 31, 2020 –– Mobiveil, Inc., a fast-growing supplier of silicon intellectual property (IP), platforms and IP-enabled design services, today announced that its 25xN RapidIO® ...

IDT’s standalone fabric interconnect (FIC) device bridges from the Serial RapidIO interface on the baseband card to a CPRI interface. Pietro Polidori Within wireless infrastructure equipment, such as ...

The extent to which 'what goes around, comes around' applies to technology. Despite the impression that companies are forging a future based on brand new ideas, that's not always the case. And so it ...

The latest RapidIO specification has been released by rapidio.org. The 25xN specification is said to provide an open standard interconnect fabric for those systems requiring heterogeneous coherent ...

Now an ECMA standard (ECMA-342), RapidIO is poised to make an impact in embedded environments. It incorporates features like error management and reco-very and ...