As traditional chip miniaturization slows, researchers have found a way to pack more computing power into the same space by stacking silicon circuits in multiple layers. The new process uses ...

MediaTek is using Intel's EMIB packaging alongside TSMC's CoWoS for AI ASIC designs, targeting 26% of the AI ASIC market by 2028 amid capacity constraints.

Today marks the fifth anniversary of the Apple silicon chip that replaced Intel chips in Apple's Mac lineup. The first Apple silicon chip, the M1, was unveiled on November 10, 2020. The M1 debuted in ...

Semiconductor substrate warpage and signal loss now have a Korean challenger to glass: Viacore and Aqlaser’s low-CTE ...

A new in-package cooling innovation tackles rising heat challenges in 3D-stacked memory chips, improving thermal efficiency ...

Samsung Electro-Mechanics disclosed on May 20, 2026, that it had signed a contract worth 1.557 trillion won to supply silicon ...

NEW DELHI, INDIA, February 14, 2026 /EINPresswire.com/ -- New Delhi — February 13, 2026 — Moores Lab AI (www.mooreslab.ai) today announced that its Chief ...

The availability of cheap digital cameras based on complementary metal–oxide–semiconductor (CMOS) technology has spurred the development of various applications in the past 20 years, including ...

Engineers at MIT have turned one of computing’s biggest headaches, waste heat, into the main act. By sculpting “dust-sized” silicon structures that steer heat as precisely as electrical current, they ...

Silicon lifecycle management is starting to be used in ways that extend well beyond its original mission of ensuring a chip functions to spec throughout its expected lifetime. While tracking aging ...