NXP Semiconductors N.V. announced the industry’s first medium power transistors in a 2-mm x 2-mm 3-pin leadless DFN package. Offering a unique solution in an ultra-small DFN2020-3 (SOT1061) ...
For a number of years now we have seen leadless DFN packages (discrete, flat, no-leads) for discrete components which, compared to conventional SMD packages, do away with contact and assembly ...
CISSOID's CHT-NMOS8001 is an N-channel MOSFET guaranteed for operation from -55°C up to +225°C. It is available in a tiny thin dual flat pack (TDFP) hermetically-sealed Ceramic SMD package, as small ...
850 nm emitter features radiant intensity to 350 mW/sr at 1 A, optical power to 660 mW, thermal resistivity down to 10 K/W junction-to-pin, and a 3.85 x 3.85 x 2.24 mm top-view SMD package. Vishay's ...
A new family of ultra small transistors has been launched by NXP, which it claims is the first to be offered in a 1.1 x 1 x 0.37mm, low profile DFN package. The range includes mosfets with RDS (on) ...
Nexperia has revealed that key parts from its SOT23-packaged family of high-performance, general-purpose transistors and switching diodes are now fully-specified for operation up to 175°C. Included in ...
Devon-based power supply maker TDK-Lambda has patented a space and cost-saving method of heat-sinking power components. In particular, it applies to a daughter-board with mixed surface-mount (SMD) and ...
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