LONDON — Alchimer SA (Massy, France), a provider of wet deposition processes for semiconductor interconnects and 3-D through-silicon vias (TSV), has said it has found a way to eliminate the seed-layer ...
PARIS — Alchimer SA, France-based provider of wet deposition processes for interconnections in 3D packaging applications, announced it has introduced a deposition process that is said to reduce cost ...
From large TSVs for MEMS to nanoTSVs for backside power delivery, cost-effective process flows for these interconnects are essential for making 2.5D and 3D packages more feasible. Through-silicon vias ...
Through-silicon vias (TSVs) provide essential interconnects between DRAM dies inside high-bandwidth memory stacks, silicon ...
Hsinchu, Taiwan, July 20, 2015 – United Microelectronics Corporation (NYSE:UMC;TWSE: 2303) ("UMC"), a leading global semiconductor foundry, today announced that it has entered volume production for ...
March 9, 2014. Rudolph Technologies Inc. announced the sale of its first NSX 320 TSV Metrology System to CEA-Leti, a leading research organization based in Grenoble, France, which, in the frame of the ...
(Nanowerk News) Imec presents a via-middle through-Si-via (TSV) approach to 3D stacking. This method is new to industry as it allows to 'reveal' TSV contacts by using a Si-etch process. The process ...
Samsung Electronics says its new 12nm-Class 32Gb DDR5 DRAM will allow for the creation of 128GB DRAM modules without the TSV process and could lead to 1TB DRAM modules in the future. With companies ...
Imec and SPTS Technologies are developing a short cycle-time dry silicon removal and low temperature passivation solution for through-silicon via-middle processing and thinning of the top-wafer in ...
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