Figure 1. SimuReal simulation with heat mapping. Heat mapping is integrated into Coriolis Composites’ SimuReal software, correcting for IR camera incidence angle (IR camera seen at far top right) to ...

As electronic devices become increasingly miniaturized, heat management at the nanoscale emerges as a challenge, especially for devices operating in sub-microns. Traditional heat conduction models ...

Simulation tools are now available to simulate complex gear measurements after heat-treatment simulation. This is the focus of the feature article that has just been published in Thermal Processing, ...

The main objective of the Clean Sky 2 (CS2) project FRAMES, which began in July 2020, is to validate a manufacturing approach being used to produce the Advanced Rear End Demonstrator manufactured by ...

PLEASANTON, Calif.--(BUSINESS WIRE)--Aavid, Boyd Corporation’s thermal product division, announced the launch of the Aavid Genie, a new web application that allows engineers, including those with ...

Nowadays, there are many interconnects in IC chips. One of the packaging goals is to connect an IC to the next level of subsystem circuitry (package substrates/print circuit boards). Mass reflow (MR) ...

Embedding chips into stacked-die assemblies is creating thermal dissipation challenges that can reduce the reliability and lifespan of these devices, a growing problem as chipmakers begin cramming ...

Download this article in PDF format. The next generation of vehicles will generate, process, and communicate much more data than current vehicles. Wireless networking via mobile technologies (e.g., 5G ...

The electronics industry is driven by a constant demand for smaller and more powerful devices. This means increased power densities and lots more heat being generated within ever-smaller spaces. As a ...