Modern semiconductor fabrication involves aligning silicon wafers and photolithography masks to nanometre precision. As the industry shifts from using 200 mm diameter wafers to 300 mm wafers, ...
At the heart of advancing semiconductor chip technology lies a critical challenge: creating smaller, more efficient electronic components. This challenge is particularly evident in the field of ...
MONTEREY, Calif. — A startup involved in “pseudo-maskless” mask technology for nano-imprint lithography took the Bacus Symposium on Photomask Technology here to announce the formation of the ...
Monterey, Calif. – A spin-out from Stanford University, Transfer Devices Inc., is offering “pseudomaskless” technology for nanoimprint lithography. The startup made its debut at the recent Bacus ...
One of the main challenges in developing semiconductor chip technology is making electronic components smaller and more effective. This difficulty is most noticeable in lithography, which is the ...
ALHAMBRA, Calif., Jan. 23, 2025 /CNW/ -- Ortel, a Photonics Foundries enterprise, today announced the successful transfer of wafer fabrication for its C-Band, High-Power, Continuous Wave Laser Module ...
There’s nothing more freeing than to be an engineer with no perceptible budget in sight. [BrendaEM] walks us through a teardown of a machine that was designed under just such a lack of constraint. It ...
The Benefits Of Curvilinear Full-Chip Inverse Lithography Technology With Mask-Wafer Co-Optimization
A technical paper titled “Make the impossible possible: use variable-shaped beam mask writers and curvilinear full-chip inverse lithography technology for 193i contacts/vias with mask-wafer ...
After a slowdown in the first half of 2019, chipmakers and equipment vendors face a cloudy outlook for the second half of this year, with a possible recovery in 2020. But what about other key ...
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