For wafers with 125 millimeter long sides, the average rate is a few percent, which explains why raw wafer singulation is still very often done by hand. But as wafers get thinner and larger, even ...

Conventional laser cutting is based on rapid heating leading to vaporization and material removal. This process is not only slow, but it also leads to unwanted micro cracks and a rough surface finish.

ORLANDO, Fla.--(BUSINESS WIRE)--Fonon Corporation, a multi-market holding company, R&D center, equipment designer and manufacturer of advanced laser material processing systems for subtractive and ...

In its ongoing push to create smaller, thinner, and denser chip packages, the semiconductor industry has intensified its focus on integrating separately manufactured components with different ...

New technology for cheaper and higher quality cutting of brittle materials for displays, phones and LED lighting. PORTLAND, Ore. and KRAILING, Germany, Aug. 31, 2012 /PRNewswire-iReach/ -- Three ...